Metallizable substrate composites and printed circuits produced

Details Metallizable substrate composites and printed circuits produced Metallizable substrate composites and printed circuits produced

1987-02-02

1987-12-22

Swisher, Nancy A.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

428901, 428209, C08K 906, C09J 500

Patent

active

047146532

ABSTRACT:
Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

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Chemical Abstracts, vol. 76, No. 12, 63968m, p. 317 (Mar. 20, 1972).

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