Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-03-04
1992-10-27
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
29846, 439 86, H01R 909
Patent
active
051584662
ABSTRACT:
A pressure type contact (10) for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers in which one wafer is plated with a raised conductive interconnection feature. The raised feature is formed by placing a small lump (44) of electrically conductive resin on a substrate (12) and then electrolytically forming on the substrate a trace (18) having an enlarged connector pad (20) that completely covers the cured projecting resin lump.
REFERENCES:
patent: 3680206 (1972-08-01), Roberts
patent: 3936930 (1976-02-01), Stern
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4000054 (1976-12-01), Marcantonio
patent: 4116517 (1978-09-01), Selvin
patent: 4403272 (1983-09-01), Larson et al.
patent: 4758459 (1988-07-01), Mehta
patent: 4813129 (1989-03-01), Karnezos
IBM Bulletin, Ward, vol. 18, No. 9, p. 2817, Feb. 1976.
Feigenbaum Haim
Schreiber Christopher M.
Swarbrick David B.
Abrams Neil
Denson-Low Wanda K.
Gudmestad Terje
Hughes Aircraft Company
Walder Jeannette M.
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