Metallic support carrier for semiconductor elements

Details Metallic support carrier for semiconductor elements Metallic support carrier for semiconductor elements

1975-03-20

1977-05-31

Wojciechowicz, Edward J.

357 68, 357 70, 357 71, H01L 2348, H01L 2944, H01L 2952, H01L 2954

Patent

active

040273261

ABSTRACT:
To improve the bonding layer for connecting wires to semiconductor chips with contact fingers, or contact strips, on the carrier, the bonding layer is formed as spongy, microporous structure, applied to discrete positions of the contact strips by screen printing, and secured to the metallic connecting strip by a diffusion zone. Preferably, the bonding layer comprises a metal of gold, palladium, silver, aluminum and copper, or an alloy of at least two of these metals, or a base alloy of one of those metals, for example gold applied as a gold paste having an average grain size of less than 5 micrometers, the layer being between 2 to 30 micrometers thick, preferably 3 to 10 micrometers.

REFERENCES:
patent: 3627901 (1971-12-01), Happ
patent: 3767519 (1973-10-01), Kojima et al.

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