Metallic ground grid for integrated circuits

Details Metallic ground grid for integrated circuits Metallic ground grid for integrated circuits

1975-03-25

1976-08-10

James, Andrew J.

357 40, 357 46, 357 54, 357 65, 357 71, H01L 2704

Patent

active

039745171

ABSTRACT:
A metallic ground conductor grid applied over a planar isolation barrier in an integrated circuit provides a low resistance ground. An insulating layer, formed over the ground conductor, has apertures therein for interconnecting selected areas of the integrated circuit to the ground conductor grid.

REFERENCES:
patent: 3423650 (1969-01-01), Cohen
patent: 3581165 (1971-05-01), Seelbach et al.
patent: 3634203 (1972-01-01), McMahon et al.
patent: 3754170 (1973-08-01), Tsuda et al.
patent: 3766445 (1973-10-01), Reuter et al.
patent: 3774079 (1973-11-01), Zechman
patent: 3862017 (1975-01-01), Tsunemitsu et al.

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