Metallic building element for optoelectronics

Details Metallic building element for optoelectronics Metallic building element for optoelectronics

2007-01-16

2007-01-16

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Forming or treating optical article

C430S314000, C430S321000, C430S323000, C430S324000, C427S135000, C427S162000, C427S405000, C249S119000, C249S130000

Reexamination Certificate

active

10112196

ABSTRACT:
The present invention relates to a method of patterning metallic building elements, and also to a metallic building element, where the measuring accuracy achieved can lie in the sub-micrometer range. Starting from a silicon master or original that can be etched to sub-micrometer precision and then plated with a metal, such as nickel (3), on the silicon surface, there can be produced a nickel shim where precision and surface fineness can lie in the sub-micrometer range. Subsequent to removal of the silicon master, a photo-sensitive material (5) can be used in liquid form or in film form to create mould cavities (9) that reach down to the nickel shim. These cavities can then be metal-plated to provide a building element (8) of higher precision in three dimensions.

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