Metallic bonding method

Details Metallic bonding method Metallic bonding method

1975-10-28

1977-09-06

Jones, Jr., James L.

Metal fusion bonding

Process

Diffusion type

228135, 228174, 228195, 228198, 428654, B23K 3530

Patent

active

040463052

ABSTRACT:
Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.

REFERENCES:
patent: 3148038 (1964-09-01), Wolfe
patent: 3180022 (1965-04-01), Briggs
patent: 3703032 (1972-11-01), Batista
patent: 3708866 (1973-01-01), Wells
patent: 3766633 (1973-10-01), Lehrheuer et al.

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