Metallic bond for mounting of optical fibers to integrated optic

Details Metallic bond for mounting of optical fibers to integrated optic Metallic bond for mounting of optical fibers to integrated optic

1988-09-08

1989-09-19

Lee, John D.

350 9615, 350 9611, G02B 636

Patent

active

048675245

ABSTRACT:
A method for pigtailing an optical fiber to a lithium niobate integrated optical device (I/O chip) is shown and described wherein the bonding between the I/O chip and the optical fiber is a metallic bond. The lithium niobate may be attached to a metallic substrate which is welded to a metallic fiber optic carrier which is in turn welded to a metallized optical fiber. The fiber optic carrier may also be made of non-metallic materials which are given a metallic coating prior to attachment to the I/O chip by means of a metallic bond such as welding.

REFERENCES:
patent: 4445751 (1984-05-01), Divens et al.
patent: 4523802 (1985-06-01), Sakaguchi et al.
patent: 4750800 (1988-06-01), Fournier et al.
patent: 4796975 (1989-01-01), Lukas et al.
patent: 4798439 (1989-01-01), Preston
patent: 4802727 (1989-02-01), Stanley

Affiliated with

Also associated with

Rating

Metallic bond for mounting of optical fibers to integrated optic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metallic bond for mounting of optical fibers to integrated optic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metallic bond for mounting of optical fibers to integrated optic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-364237