Metallic adhesive for forming electronic interconnects at low te

Details Metallic adhesive for forming electronic interconnects at low te Metallic adhesive for forming electronic interconnects at low te

1997-10-27

2000-02-22

Wyszomierski, George

Metal treatment

Compositions

Fluxing

420555, B23K 3526

Patent

active

060275758

ABSTRACT:
The invention is a self-low-temperature curing metallic adhesive with thermal and electrical conductivity. It comprises a paste mixture of a liquid metal having a melting temperature below 30.degree. C. and comprising: (1) 99.2-75 wt. % gallium and (2) aluminum or zinc and (3) optionally tin or indium; and a metallic powder selected from the group consisting of: zirconium, rare earth elements, copper, nickel, silver, antimony, cobalt, chromium, germanium, gold, iron, magnesium, manganese, platinum, palladium, and vanadium, and combinations of any of them.

REFERENCES:
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5221038 (1993-06-01), Melton et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5429292 (1995-07-01), Melton et al.
patent: 5445308 (1995-08-01), Nelson et al.

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