Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-06-01
1993-04-06
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 156630, 174262, 361412, 428901, H05K 336
Patent
active
051991632
ABSTRACT:
A structure and process for forming dense multi-layer thin film structures wherein individual layers of thin film wiring which can be pre-inspected and then laminated one on top of the next to form a three dimensional wiring matrix are disclosed.
REFERENCES:
patent: 2692190 (1954-10-01), Pritikin
patent: 3181986 (1965-05-01), Pritikin
patent: 3606677 (1971-09-01), Ryan
patent: 3729819 (1973-05-01), Horie
patent: 3953924 (1976-05-01), Zachry et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4420352 (1983-12-01), Schroeder et al.
patent: 4604160 (1986-08-01), Murakami et al.
patent: 4606787 (1986-08-01), Pelligrino
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4724020 (1988-02-01), Ebata et al.
patent: 4767479 (1988-08-01), Ferguson et al.
patent: 4790902 (1988-12-01), Wada et al.
patent: 4799984 (1989-01-01), Rellick
patent: 4830691 (1989-05-01), Kida et al.
patent: 4889584 (1989-12-01), Wada et al.
patent: 4897918 (1990-02-01), Osaka et al.
patent: 4928870 (1990-05-01), Gat-Liquornik et al.
patent: 4952454 (1990-08-01), Iwamoto et al.
patent: 4953627 (1990-09-01), Ito et al.
patent: 4961259 (1990-10-01), Schreiber
IBM Technical Disclosure Bulletin, vol. 2, No. 1 Jun. 1959 p. 9 by Haddad et al.
IBM Technical Disclosure Bulletin vol. 8, No. 8 Jan. 1966 pp. 1025-1026 by Webb et al.
IBM Technical Disclosure Bulletin vol. 9 No. 11 Apr. 1967 pp. 1520-1521 by Kollmeier et al.
Ehrenberg Scott G.
Poetzinger Janet L.
Arbes Carl J.
Blecker Ira David
International Business Machines - Corporation
LandOfFree
Metal transfer layers for parallel processing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal transfer layers for parallel processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal transfer layers for parallel processing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-527785