Metal support for an electronic component interconnection networ

Chemistry: electrical and wave energy – Processes and products

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Details

204 34, 427 34, C25D 1104

Patent

active

042857813

ABSTRACT:
In a support for an electronic component interconnection network, a metal substrate coated with a layer of aluminium of granular structure, whose thickness may vary between a few microns and a few tens of microns, this layer being anodized.

REFERENCES:
patent: 3607381 (1971-09-01), Fairbairn
patent: 3699011 (1972-10-01), Nishimura
patent: 3935083 (1976-01-01), Tomozawa et al.
patent: 3941630 (1976-03-01), Larrabee
patent: 4133724 (1979-01-01), Hartnagel et al.

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