Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-04-26
1995-08-01
Gregory, Bernarr E.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361688, H02B 156, H05K 720
Patent
active
H00014710
ABSTRACT:
Disclosed is a circuit board and a process for the manufacture thereof providing a circuit board comprising a metal core having parallel first and second major faces and exhibiting high thermal and electrical conductivity. The circuit board includes electrical insulating layers of thermally conductive, dielectric material applied to the first and second major faces of the metal core. Protecting the dielectric layer and copper conductors is a solder mask layer applied to the dielectric layers and forming outward facing major surfaces. A plurality of insulated and grounded vias having electrically conductive interior rings connecting the major surfaces are provided through the board. Conductive sleeves within the vias are either electrically insulated from the metal core by dielectric material or in electrical contact to the metal core for grounding.
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Braun David J.
Daun-Lindberg Timothy C.
Guenther Charles J.
Hagan James A.
Hoffmeyer Mark K.
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