Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-09-18
2007-09-18
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S692000, C257S773000, C257SE23043, C361S813000, C438S121000
Reexamination Certificate
active
11086238
ABSTRACT:
A metal substrate apparatus comprises a plurality of metal substrates forming an IC card module used in manufacturing transfer mold-type non-contact IC cards. The metal substrate apparatus comprises a thin metal strip of processing material, and each metal substrate has connecting parts. Each metal substrate has a die pad for loading an IC chip. Antenna terminals to connect antenna coils are located outside the die pad and a resin-sealed region. The antenna terminals of one metal substrate and those of a longitudinally adjacent metal substrate overlap a shared region of the processing material in a width direction. The metal substrates can be separated by sealing and then making longitudinal cuts on the processing material on the outer parts of the metal substrates along two connecting lines.
REFERENCES:
patent: 2004/0018663 (2004-01-01), Michii et al.
patent: 1-302757 (1989-12-01), None
patent: 7-058273 (1995-03-01), None
patent: 2000-174176 (2000-06-01), None
Ikenaga Chikao
Masuda Masachika
Chambliss Alonzo
Dai Nippon Printing Co. Ltd.
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