Metal structure and method of its production

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating has specified thickness variation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C205S118000

Reexamination Certificate

active

07922887

ABSTRACT:
The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.

REFERENCES:
patent: 5527734 (1996-06-01), van der Putten et al.
patent: 5631119 (1997-05-01), Shinozaki
patent: 6245676 (2001-06-01), Ueno
patent: 6287950 (2001-09-01), Wu et al.
patent: 6316059 (2001-11-01), van der Putten et al.
patent: 6326556 (2001-12-01), Asai et al.
patent: 6387807 (2002-05-01), Faubert et al.
patent: 6511588 (2003-01-01), Kobayashi et al.
patent: 6553662 (2003-04-01), Sedberry
patent: 6825541 (2004-11-01), Huang et al.
patent: 7144490 (2006-12-01), Cheng et al.
patent: 2002/0084191 (2002-07-01), Haba et al.
patent: 2003/0178547 (2003-09-01), Wang et al.
patent: 2004/0066732 (2004-04-01), Takemoto et al.
patent: 2004/0134786 (2004-07-01), Chiang et al.
patent: 2005/0045488 (2005-03-01), Paneccasio et al.
patent: 2005/0087447 (2005-04-01), Haba et al.
patent: 2005/0089671 (2005-04-01), Kubota
patent: 03-256603 (1991-11-01), None
patent: 4-234126 (1992-08-01), None
patent: 05-334163 (1993-12-01), None
patent: 07-198918 (1995-08-01), None
patent: 7-336018 (1995-12-01), None
patent: 09-063756 (1997-03-01), None
patent: 10-012545 (1998-01-01), None
patent: 10-338213 (1998-12-01), None
patent: 11-238703 (1999-08-01), None
patent: 2000-158157 (2000-06-01), None
patent: 2000-248397 (2000-09-01), None
patent: 2002-184752 (2002-06-01), None
patent: 2003-243399 (2003-08-01), None
patent: 2003-247097 (2003-09-01), None
patent: 2004-200699 (2004-07-01), None
patent: 2004-263202 (2004-09-01), None
patent: 2005-50965 (2005-02-01), None
patent: 2005-51151 (2005-02-01), None
patent: 2006-210565 (2006-08-01), None
patent: WO 03/009361 (2003-01-01), None
patent: WO 03/088396 (2003-10-01), None
Anisotropic Deposition of Electroless Nickel; J. Electrochem. Soc.; vol. 140, No. 8; Aug. 1993.
Structural Evolution of Electroless Nickel Bump; Journal of the Electrochemical Society; 150(5) C273-C276; 2003.
Zashchita Metallov (1972), 8(3), pp. 338-342.
Andre M.T. van der Putten et al., “Anisotropic Deposition of Electroless Nickel”, vol. 140, No. 8, Aug. 1993, pp. 2229-2235.
Kwang-Lung Lin et al., “Structural Evolution of Electroless Nickel Bump”, 150(5), C273-C276 (2003).
JP Office Action of Application 2005-019395 dated Aug. 21, 2009 with English translation.
JP Office Action of Application 2005-019395 dated Sep. 1, 2009 with English translation.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal structure and method of its production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal structure and method of its production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal structure and method of its production will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2715453

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.