Metal structure and fabrication method thereof

Details Metal structure and fabrication method thereof Metal structure and fabrication method thereof

2009-03-06

2011-11-08

Roe, Jessee R. (Department: 1733)

Metal treatment

Process of modifying or maintaining internal physical...

Producing or treating layered, bonded, welded, or...

C148S675000

Reexamination Certificate

active

08052810

ABSTRACT:
A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.

REFERENCES:
patent: 2637896 (1953-05-01), Nachtman
patent: 3355268 (1967-11-01), Du Rose et al.
patent: 3486996 (1969-12-01), Annand
patent: 4021271 (1977-05-01), Roberts
patent: 4247326 (1981-01-01), Quinto et al.
patent: 4507180 (1985-03-01), van der Werf et al.
patent: 2001/0009724 (2001-07-01), Chen et al.
patent: 2004/0104739 (2004-06-01), Haga et al.
patent: 2005/0028900 (2005-02-01), Chu et al.
patent: 1058845 (1992-02-01), None
patent: 56-35758 (1981-04-01), None
patent: 59-177388 (1984-10-01), None
patent: 9-35337 (1997-02-01), None
patent: 10-25594 (1998-01-01), None
patent: 11-64381 (1999-03-01), None
patent: 2001-116765 (2001-04-01), None
patent: 2001-516812 (2001-10-01), None
patent: 2001-343397 (2001-12-01), None
patent: 2002-148975 (2002-05-01), None
patent: 2002-296296 (2002-10-01), None
patent: 593704 (2004-06-01), None
patent: WO 99/14404 (1999-03-01), None
“Next Generation IC Testing Microspring ‘Contact Probe’ Developed,” Sumitomo Electric Industries News Letter, Jan. 2002, pp. 3, No. 292 (w/ English Translation).
Eiju Takamizawa, “Introduction to Nickel Metallurgy,” pp. 548-551, Taiyokaku Limited Partnership Corporation (w/Partial English Translation).
Chinese Office Action for Corresponding Application No. 2004800098112 Mailed Dec. 8, 2006.
Taiwanese Office Action, with English Translation, issued in Taiwanese Patent Application No. TW 093110356, mailed on Jan. 29, 2008.

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