Metal sputtering target assembly

Details Metal sputtering target assembly Metal sputtering target assembly

1996-08-01

1997-11-18

Larson, Lowell A.

Metal deforming

By use of tool acting during relative rotation between tool...

With modification or control of temperature of work, tool or...

72 82, 20429812, B21D 2216

Patent

active

056876009

ABSTRACT:
Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the blank is in the shape of a sputtering target or backing plate. The target and backing plate so produced are also described.

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J.A. Dunlop et al., "Effects of aluminum silicon copper sputtering target processing methods on thin film uniformity and process control during very large scale integrated device fabrication", Journal of Vacuum Science & Technology, Second Series, vol. 11, No. 4, Part 1, Jul./Aug. 1993, pp. 1558-1565.

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