Metal-semiconductor resistive ribbon for thermal transfer printi

Details Metal-semiconductor resistive ribbon for thermal transfer printi Metal-semiconductor resistive ribbon for thermal transfer printi

1982-03-10

1984-09-11

Wright, Jr., Ernest T.

Typewriting machines

Including interposed inking device for record-medium

Ribbon, per se

400120, 428913, 428914, B41J 3102

Patent

active

044707142

ABSTRACT:
A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of non-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ribbon, as well as methods for non-impact printing employing the disclosed ribbon.

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patent: 4308318 (1981-12-01), Welche
patent: 4309117 (1982-01-01), Chang et al.
patent: 4320170 (1982-03-01), Findlay
IBM Technical Disclosure Bulletin, "Thermal Printer Ribbons", Crooks et al., vol. 18, No. 7, Dec. 1975, p. 2267-2268.
IBM Technical Disclosure Bulletin, "Polypyrrole Toluenesulfonate Films for Resistive Ribbon,38 Diaz et al., vol. 23, No. 12, May 1981, p. 5552.
IBM Technical Disclosure Bulletin, "Thermal Printing Ribbon", Findlay, vol. 24, No. 10, Mar. 1982, p. 5236.
IBM Technical Disclosure Bulletin, "Inorganic Resistive Layer for Electrothermal Printing," Chang, vol. 24, No. 11B, Apr. 1982, p. 6195.
IBM Technical Disclosure Bulletin, "Amorphous Film Printing using D.C. Power and Pulse Selection", Aviram et al., vol. 25, No. 5, Oct. 1982, pp. 2602-2603.
Soviet Powder Metallurgy and Metal Ceramics, "Solid-Phase Synthesis of Some Transition Metal Silicides", Voronov et al., vol. 13, No. 12 (144), pp. 962-965, Published May 1975.

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