Metal seal packaging for organic light emitting diode device

Details Metal seal packaging for organic light emitting diode device Metal seal packaging for organic light emitting diode device

2007-04-10

2007-04-10

Patel, Ashok (Department: 2879)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C313S504000, C313S509000

Reexamination Certificate

active

10818042

ABSTRACT:
A metal sealed organic light emitting diode device comprising a lid, containing a recessed portion to accommodate large quantity of getter/dessicant, a band of metal stack at the perimeter over which is laid a band of low temperature melting solder alloy, pre-tinned subsequently, and a substrate. The substrate containing organic light emitting diode at the central area with a band of metal stack at the perimeter. The lid and the substrate are placed together in substantial alignment such that the pre-tinned low melting solder band of the lid contacts the metal stack of the substrate and thermally sealed in a controlled atmosphere. Multiples of substrates are sealed with a single lid containing multiplicity of recessed portions with multi-segmented metal stack and pre-tinned solder band to derive a large area device.

REFERENCES:
patent: 6573652 (2003-06-01), Graff et al.
patent: 6628071 (2003-09-01), Su
patent: 6657382 (2003-12-01), Nagai et al.
patent: 2004/0119403 (2004-06-01), McCormick et al.

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