Metal powder injection moldable composition, and injection moldi

Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Powder pretreatment

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

419 44, 419 54, 75252, B22F 312

Patent

active

060511842

ABSTRACT:
A metal powder injection moldable composition which hardly causes debinding deformation is obtained. This composition consists of a metal powder and an organic binder. The components which constitute the organic binder are:

REFERENCES:
patent: 4197118 (1980-04-01), Weich
patent: 4305756 (1981-12-01), Weich
patent: 4404166 (1983-09-01), Weich
patent: 4624812 (1986-11-01), Farrow et al.
patent: 5043121 (1991-08-01), Wingefeld et al.
patent: 5080846 (1992-01-01), Kim et al.
patent: 5122326 (1992-06-01), Jackson et al.
patent: 5362791 (1994-11-01), Ebenhoech et al.
patent: 5531958 (1996-07-01), Krueger
patent: 5695697 (1997-12-01), Trubenbach et al.
patent: 5737683 (1998-04-01), Sterzel
patent: 5746960 (1998-05-01), Kasai et al.
patent: 5802437 (1998-09-01), Wohlfromm et al.
patent: 5860055 (1999-01-01), Hesse et al.
"Ceramic Injection Molding With A Polyacetal Based Binder System", Advances In Powder Metallurgy And Panticulate Meterals, vol. 5, 1993 p 45-56.
"Modifying Polyacetal Binder Based Feedstock To Improve Quality Of MIM Parts", Advances In Powder Metallurgy And Panticulate Materials, Part 18, 1997 p 45-55.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal powder injection moldable composition, and injection moldi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal powder injection moldable composition, and injection moldi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal powder injection moldable composition, and injection moldi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2334157

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.