Metal-powder filled epoxy resin mold

Static molds – Container-type molding device – Of named component

Patent

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Details

249135, B28B 700

Patent

active

051567547

ABSTRACT:
In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back-up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a conductive plastic paint before being subjected to the electric metal plating in an electrolytic solution.

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patent: 4225109 (1980-09-01), Yotsutsuji et al.
patent: 4468363 (1984-08-01), Miessler
patent: 4509358 (1985-04-01), Krowl
patent: 4834929 (1989-05-01), Dehoff et al.
patent: 4940561 (1990-07-01), Fritz

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