Metal powder composition for metallization and a metallized subs

Details Metal powder composition for metallization and a metallized subs Metal powder composition for metallization and a metallized subs

1996-09-12

1998-06-16

Kastler, Scott

Specialized metallurgical processes, compositions for use therei

Compositions

Loose particulate mixture containing metal particles

420492, B22F 100

Patent

active

057663050

ABSTRACT:
A metal powder composition for metallization is for use in forming a metallized film from a paste comprising Cu and Ti powder and consists essentially of about 95 to 99.5% Cu and 0.5 to less than 5% Ti by weight. The above-mentioned paste is then applied onto a substrate and then fired to provide a metallized substrate.

REFERENCES:
patent: 3994734 (1976-11-01), Cuthbert

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