Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Reexamination Certificate
2007-01-30
2010-12-28
Culbert, Roberts (Department: 1716)
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
C252S079100, C438S692000, C051S309000
Reexamination Certificate
active
07857985
ABSTRACT:
The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.
REFERENCES:
patent: 3922393 (1975-11-01), Sears, Jr.
patent: 4673524 (1987-06-01), Dean
patent: 4944836 (1990-07-01), Beyer et al.
patent: 5545429 (1996-08-01), Booth et al.
patent: 5795695 (1998-08-01), Malhotra et al.
patent: 6301770 (2001-10-01), McIlwraith
patent: 6485812 (2002-11-01), Sekiguchi
patent: 6527818 (2003-03-01), Hattori et al.
patent: 6565619 (2003-05-01), Asano et al.
patent: 6893476 (2005-05-01), Siddiqui et al.
patent: 7118685 (2006-10-01), Yoneda et al.
patent: 7153335 (2006-12-01), Siddiqui et al.
patent: 7300480 (2007-11-01), Bian et al.
patent: 7309684 (2007-12-01), Filippini et al.
patent: 7514363 (2009-04-01), Banerjee et al.
patent: 7527861 (2009-05-01), Li et al.
patent: 7547670 (2009-06-01), Gross et al.
patent: 7604751 (2009-10-01), Yoneda et al.
patent: 7625967 (2009-12-01), St. Clair
patent: 7691287 (2010-04-01), Siddiqui et al.
patent: 2002/0055562 (2002-05-01), Butuc
patent: 2003/0061766 (2003-04-01), Vogt et al.
patent: 2003/0157804 (2003-08-01), Puppe
patent: 2004/0040217 (2004-03-01), Takashina et al.
patent: 2004/0044116 (2004-03-01), Olson et al.
patent: 2004/0109853 (2004-06-01), McDaniel
patent: 2004/0175407 (2004-09-01), McDaniel
patent: 2004/0186206 (2004-09-01), Yoneda et al.
patent: 2004/0244300 (2004-12-01), Ichiki et al.
patent: 2005/0076578 (2005-04-01), Siddiqui
patent: 2005/0079718 (2005-04-01), Siddiqui et al.
patent: 2005/0090109 (2005-04-01), Carter
patent: 2005/0112892 (2005-05-01), Chen et al.
patent: 2005/0118821 (2005-06-01), Minamihaba et al.
patent: 2005/0142084 (2005-06-01), Ganguly et al.
patent: 2005/0208883 (2005-09-01), Yoshida et al.
patent: 2006/0117667 (2006-06-01), Siddiqui et al.
patent: 2006/0182788 (2006-08-01), Singh et al.
patent: 2006/0240672 (2006-10-01), Yoneda et al.
patent: 2007/0036738 (2007-02-01), Fletcher et al.
patent: 2007/0045233 (2007-03-01), Yoneda et al.
patent: 2007/0093187 (2007-04-01), Takenouchi
patent: 2007/0167016 (2007-07-01), Yamashita
patent: 2007/0176142 (2007-08-01), Kikuchi
patent: 2007/0181850 (2007-08-01), Kamimura
patent: 2007/0186484 (2007-08-01), Yamashita et al.
patent: 2007/0275021 (2007-11-01), Lee et al.
patent: 2008/0057336 (2008-03-01), Kurokawa et al.
patent: 2008/0057716 (2008-03-01), Yamashita
patent: 2008/0182485 (2008-07-01), Siddiqui et al.
patent: 2009/0258060 (2009-10-01), Cleary et al.
patent: 1813656 (2007-08-01), None
patent: 49-122432 (1974-11-01), None
patent: 63-123807 (1988-05-01), None
patent: 2-278822 (1990-11-01), None
patent: 6-199515 (1994-07-01), None
patent: 8-83780 (1996-03-01), None
patent: 11-186202 (1999-07-01), None
patent: 2000084832 (2000-03-01), None
patent: 2001-127019 (2001-05-01), None
patent: 2001-139935 (2001-05-01), None
patent: 2001-279231 (2001-10-01), None
patent: 2003017446 (2003-01-01), None
patent: 2003142435 (2003-05-01), None
patent: 2003-197573 (2003-07-01), None
patent: 2003-244092 (2003-08-01), None
patent: 2005-142542 (2005-06-01), None
patent: 2005-159269 (2005-06-01), None
patent: 2005-167204 (2005-06-01), None
patent: 2005-175218 (2005-06-01), None
patent: 2005-177970 (2005-07-01), None
patent: 2008-512871 (2008-04-01), None
patent: 0104231 (2001-01-01), None
patent: 2004/101221 (2004-11-01), None
patent: 2004101221 (2004-11-01), None
Haba, S. et al., “Metal-film Abrasive Compound for Polishing,” Derwent Information Ltd., 2009, pp. 1-8.
European Search Report issued in counterpart EP 07002005.2 dated Jul. 30, 2009.
Japanese Office Action issued in corresponding Japanese Application No. 2006-021511, dated Oct. 26, 2010.
Ishima Mihoko
Kato Tomoo
Nishiwaki Yoshinori
Takenouchi Kenji
Yamashita Katsuhiro
Culbert Roberts
Fujifilm Corporation
Sughrue & Mion, PLLC
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