Metal plating process

Details Metal plating process Metal plating process

1978-10-06

1981-03-24

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 35R, 204200, 204201, C25D 534, C25D 548, C25D 1716, C25D 1728

Patent

active

042578531

ABSTRACT:
A metal plating process and apparatus is disclosed and includes a plurality of pre-plating stations comprising tanks or reservoirs containing various cleaning and rinsing solutions. A pulse plating or gold flash station including a plating tank is provided after the pre-plating stations, and a plurality of post-plating stations or tanks are provided after the pulse-plating station. Rotatable barrels for containing work loads are carried along a path of travel from station to station along the process. Differential speed mechanisms are provided along the process so that the work load containers rotate at a slower rate of rotation while traveling through air than while the containers are disposed within the various tanks or stations along the process. The pulse-plating of the work load at the plating station takes place in a chemical bath while rotating the work load within the bath, controlling the chemistry of the bath including the gold concentration, controlling the duty cycle of the pulse-plating operation, controlling the rotation of the work load within the bath, and controlling such other parameters as the bath temperature.

REFERENCES:
patent: 838717 (1906-12-01), Hutchinson
patent: 2451341 (1948-10-01), Jernstedt
patent: 2678909 (1954-05-01), Jernstedt
patent: 3607712 (1971-09-01), Barton
patent: 3855107 (1974-12-01), McInnes
Modern Electroplating, edited by Frederick Lowenheim, 1963, pp. 207-223, 545-555.

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