Metal plating process

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 97, 4274431, B05D 512

Patent

active

047511060

ABSTRACT:
A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3615736 (1971-10-01), Stone
patent: 4001470 (1977-01-01), Schulze-Berger
patent: 4419183 (1983-12-01), Gulla
patent: 4450191 (1984-05-01), Arcilesi
patent: 4481236 (1984-11-01), Forsterling
patent: 4515829 (1985-05-01), Deckert
patent: 4554182 (1985-11-01), Bapp
Deckert et al, "Improved Post-Pesmear Process . . . ", Printed Circuit WC 111-37, May, 1984.

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