Metal-plating of cured and sintered transient liquid phase sinte

Details Metal-plating of cured and sintered transient liquid phase sinte Metal-plating of cured and sintered transient liquid phase sinte

1997-03-03

1999-07-13

Talbot, Brian K

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427125, 427304, 4273722, 427437, B05D 512

Patent

active

059223979

ABSTRACT:
In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

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patent: 5603158 (1997-02-01), Murata et al.
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