Metal pattern forming method

Details Metal pattern forming method Metal pattern forming method

2011-05-24

2011-05-24

Parker, Frederick J (Department: 1715)

Coating processes

Heat decomposition of applied coating or base material

Coating decomposed to form metal

C427S226000, C427S261000, C427S265000, C427S266000

Reexamination Certificate

active

07947328

ABSTRACT:
A metal pattern forming method includes the steps of: applying one of a metal salt solution and an acetylene compound solution onto the substrate, the acetylene compound solution containing an acetylene compound expressed by a general formula of:in-line-formulae description="In-line Formulae" end="lead"?(R.(C≡C)l)k-(L)-(A)m,in-line-formulae description="In-line Formulae" end="tail"?where R is one of a metal element, hydrogen, a carboxyl group or salt thereof, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group and a heterocyclic group, L is one of a compound linking A with a carbon-carbon triple bond and a group having (k+m) valency, A is one of a polyoxyether group, a polyaminoether group and polythioether group, k and l are integers not less than 1, and m is an integer not less than 0; and then applying the other of the metal salt solution and the acetylene compound solution onto the substrate so that the metal salt solution reacts with the acetylene compound solution to form a metal precipitate on the substrate, wherein at least one of the applying steps is performed by using an inkjet apparatus to directly form the metal pattern composed of the metal precipitate on the substrate.

REFERENCES:
patent: 4927897 (1990-05-01), Kawata et al.
patent: 5055537 (1991-10-01), Kawata et al.
patent: 7279195 (2007-10-01), Kano et al.
patent: 1-131250 (1989-05-01), None
patent: 2001-154215 (2001-06-01), None
patent: 2002254215 (2001-06-01), None
patent: 2002-134878 (2002-05-01), None
patent: 2002134878 (2002-10-01), None

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