Metal oxide powder for high precision polishing and method...

Details Metal oxide powder for high precision polishing and method... Metal oxide powder for high precision polishing and method...

2006-08-15

2006-08-15

Vanoy, Timothy (Department: 1754)

Chemistry of inorganic compounds

Oxygen or compound thereof

Metal containing

C423S625000, C423S335000, C423S337000, C423S608000, C423S618000, C423S605000, C423S263000, C423S610000, C423S622000, C106S003000, C051S307000, C051S308000, C051S309000

Reexamination Certificate

active

07090821

ABSTRACT:
The present invention relates to a metal oxide powder for high precision polishing and prepartion thereof, comprising aggregates formed by cohesion of primary particles, which has a cohesive degree (α) of 1.1 to 2.0 and a cohesive scale (β) of 3 to 10, the cohesive degree (α) and the cohesive scale (β) being defined by formula (I) and formula (II), respectively:in-line-formulae description="In-line Formulae" end="lead"?α=6/(S×ρ×d(XRD))   (I)in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?β=weight average particle diameter/d(XRD)   (II)in-line-formulae description="In-line Formulae" end="tail"?wherein, S is the specific surface area of the powder; ρ, the density; and d(XRD), the particle diameter of the powder determined by X-ray diffraction analysis. In accordance with the present invention, it is possible to provide a high polishing speed and reduce scratches.

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patent: WO 99/59754 (1999-11-01), None

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