Chemistry of inorganic compounds – Oxygen or compound thereof – Metal containing
Reexamination Certificate
2011-03-08
2011-03-08
Silverman, Stanley (Department: 1793)
Chemistry of inorganic compounds
Oxygen or compound thereof
Metal containing
C423S604000, C977S762000, C977S773000, C977S775000, C977S776000
Reexamination Certificate
active
07901656
ABSTRACT:
The present invention provides a copper oxide-containing composition that includes copper oxide nanoparticles and one or more heteroatom donor ligands bonded to the surface of the nanoparticles, where x and y are numbers having a ratio that is equal to the ratio of the average number of M atoms to the average number of O atoms in the nanoparticles. The nanoparticles are stabilized by the one or more heteroatom donor ligands which act as a protective layer that cap the surface of the nanoparticles. The present invention also provides a solution of the copper oxide nanoparticles that may be applied to a substrate and then subsequently reduced to copper metal. Finally, the invention provides a method of preparing the copper oxide nanoparticles.
REFERENCES:
patent: 5262357 (1993-11-01), Alivisatos et al.
patent: 5491114 (1996-02-01), Goldstein
patent: 5559057 (1996-09-01), Goldstein
patent: 5576248 (1996-11-01), Goldstein
patent: 5670279 (1997-09-01), Goldstein
patent: 5755987 (1998-05-01), Goldstein et al.
patent: 5850064 (1998-12-01), Goldstein
patent: 5897945 (1999-04-01), Lieber et al.
patent: 5922403 (1999-07-01), Tecle
patent: 6060026 (2000-05-01), Goldstein
patent: 6203768 (2001-03-01), McCormick et al.
patent: 6268041 (2001-07-01), Goldstein
patent: 6277740 (2001-08-01), Goldstein
patent: 6361660 (2002-03-01), Goldstein
patent: 6455746 (2002-09-01), Dubois et al.
patent: 6645444 (2003-11-01), Goldstein
patent: 6860924 (2005-03-01), Rajagopalan et al.
patent: 6887151 (2005-05-01), Leen et al.
patent: 6887297 (2005-05-01), Winter et al.
patent: 7022910 (2006-04-01), Gaudina et al.
patent: 2002/0006723 (2002-01-01), Goldstein
patent: 2002/0098680 (2002-07-01), Goldstein
patent: 2003/0003300 (2003-01-01), Korgel et al.
patent: 2003/0008145 (2003-01-01), Goldstein
patent: 2003/0115988 (2003-06-01), Poznarsky et al.
patent: 2003/0192585 (2003-10-01), Beckenbaugh et al.
patent: 2003/0230337 (2003-12-01), Gaudiana et al.
Aslam et al., “Formation of Cu and Cu2O Nanoparticles by Variation of the Surface Ligand: Preparation, Structure, and Insulation-to-Metallic Transition,” Journal of Colloid and Interface Science 255, 79-90 (2002); published online Nov. 22, 2002.
Borgohain et al., “Quantum size effects in CuO nanoparticles,” Physical Review B 61, 16, 11093-11096, Apr. 15, 2000.
Ziegler et al, “Synthesis of Organic Monolayer-Stabilized Copper Nanocrystals in Supercritical Water,” Journal of the American Chemical Society 2001, 123, 7797-7803.
Dong et al. “Preparation of Cuprous Oxide Particles of Different Crystallinity,” Journal of Colloid and Interface Science 241, 85-89 (2001).
Wang et al. “Preparation of nanocrystalline metal oxide powders with the surfactant mediated method,” Inorganic Chemistry Communications 5, (2002) 751-755.
Fan et al. “Preparation of Cu-AI2O3 nano-composite powders by electroless copper plating,” Cailiao Kexue Yu Gongyi (2002), 10(4), 357-361.
“Surface and Size Effect on the Lattice Parameter in Small Particles of Gold and Platinum”, C. Solliard & M. Flueli, Surface Science, 156, 1985, pp. 487-494.
“Dependence of Lattice Parameters”, J. Woltersdorf et al., Surface Science, pp. 65-69.
“Hyperfine Interactions in Stripped Atoms Isoelectronic with Alkali Atoms”, S.N. Ray, James E. Rodgers & T.P. Das, The American Physical Society, vol. 13, No. 6, Jun. 1976.
“The Melting of Small Particles of Lead and Indium”, C.J. Coombes, Journal of Physics F—Metal Physics, vol. 2, 1972, pp. 440-448.
“Melting Behvior of Nanocrystalline Aluminum Powders”, J. Eckert, J.C. Holzer, C.C. Ahn, Z. Fu and W.L. Johnson, Nanostructured Materials, vol. 2, 1983, pp. 407-413.
“The Size Dependence of the Melting Point of Small Particles of Tin”, C.R.M. Wronski, British Journal of Applied Physics, vol. 18, Jan. to Dec. 1967, pp. 1731-1737.
“The Instability of Polycrystalline Thin Films: Experiment and Theory”, K.T. Miller & F.F. Lange, Journal of Materials Research, vol. 5, No. 1, Jan. 1990, pp. 151-160.
“Condensation of Ordered nanocrystal Thin Films”, Brian A. Korgel & Donald Fitzmaurice, Physical Review Letters, vol. 80, No. 16, Apr. 20, 1998, pp. 3531-3534.
“The Cracking and Decohesion of Thin Films”, A.G. Evans, M.D. Drory & M.S. Hu, Journal of Materials Research, vol. 3, No. 5, Sep./Oct. 1988, pp. 1043-1049.
“Spin-On Cu Films for Ultralarge Scale Integrated Metallization”, Hirohiko Murakami et al., Journal of Vacuum Science & Technology B, 17(5), Sep./Oct. 1999, pp. 2321-2324.
“Chemical Vapor Deposition of Copper for Multilevel Metallization”, Alain E. Kaloyeros & Michael A. Fury, Material Research Socity Bulletin, vol. XVIII, No. 6, Jun. 1993, pp. 22-28.
“Estimation of the Variation of the melting Temperature with the Size of Small Particles, on the Basis of a Surface-Phonon instability Model”, M. Wautelet, Journal of Physics D, Applied Physics, vol. 24, No. 3, Mar. 14, 1991, pp. 343-346.
International Search Report dated Nov. 18, 2004 in corresponding PCT/US04/08369, filed Mar. 19, 2004, 1 pg.
Dezelah, IV Charles L.
Winter Charles H.
Brooks & Kushman P.C.
Silverman Stanley
Wayne State University
Zimmer Anthony J
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