Metal matrix composite power dissipation apparatus

Details Metal matrix composite power dissipation apparatus Metal matrix composite power dissipation apparatus

1996-10-28

1997-09-09

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 174 163, 257714, 428901, H05K 720

Patent

active

056662696

ABSTRACT:
A liquid cooled power dissipation apparatus (10) includes a metal matrix composite heat sink (11) with an insulation layer (17) integral to the apparatus (10). The insulation layer (17) is made integral to the apparatus (10) during infiltration of the metal matrix composite heat sink (11). Electronic components 23 are situated on top of the insulation layer (17).

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"Metal-Matrix Composites for Electronic Packaging" by Carl Zweben, JOM, vol. 44, Iss. 7, pp.15-23, Jul. 1992.
Japanese Patent Abstract for Hitachi, Ltd. having publication No. JP61029160, application No. JP840149502, and a publication date of Feb. 10, 1986. 1 page.

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