Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-05-01
1994-02-15
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 802, 165185, 361690, 428901, H05K 720
Patent
active
052872483
ABSTRACT:
A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improve thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the board may be parallel to the mounting surface of the board throughout their length. The matrix material for the composite material may be a metal, such as aluminum, that has some capacity to conduct heat. The device may include at least two thermally conductive wedges in the board for conducting heat into and out of the interior of the board. The wedges and the metal matrix may be the same conductive metal. A plurality of the fibers and the metal matrix contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that the wedges may be formed by placing the fibers in layers having decreasing lengths and adding the metal matrix material.
REFERENCES:
patent: 4849858 (1989-07-01), Graper et al.
patent: 4867235 (1989-09-01), Graper et al.
E-Systems Inc.
Thompson Gregory D.
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