Metal material adhesion method

Details Metal material adhesion method Metal material adhesion method

2005-11-22

2005-11-22

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C427S327000

Reexamination Certificate

active

06966965

ABSTRACT:
A metal material adhesion method is described. The method is used for an optical transceiver module assembly process to adhere a protection cover of a laser diode in a metal shell and enhance the adhesion strength thereof. The method employs the following steps. First, the protection cover and the metal shell are provided. A primer layer is coated inside the metal shell. The laser diode is aligned with the metal shell to provide a maximum signal strength position. An epoxy layer is glued between the metal shell and the protection cover to fix the laser diode in the best position. The method further provides a sealant layer to protect the epoxy layer from moisture and a second premier layer to enhance the adhesion strength between the protection cover and the epoxy layer.

REFERENCES:
patent: 4762579 (1988-08-01), Shimizu et al.
patent: 5879810 (1999-03-01), Ellwood et al.

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