Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2007-07-17
2007-07-17
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S022000
Reexamination Certificate
active
10803884
ABSTRACT:
A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask1on a circuit board2having an electrode21formed in a predetermined pattern to join an end portion of a lead member6, and moving a printing squeegee along the upper surface of the metal mask1to thereby print a lead-free solder paste on the surface of the electrode21on the circuit board2. The method produces on the electrode21of the circuit board2two lead-free solder paste patterns30a, 30aeach circular or elliptical in shape and arranged in a direction in which the lead member6is to extend from the electrode.
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European Patent Office Communication for corresponding European Patent Application No. 04006594 dated Jul. 23, 2004.
Komamizu Shuichi
Makino Kazumi
Mori Takayuki
Armstrong Kratz Quintos Hanson & Brooks, LLP
Johnson Jonathan
Sanyo Electric Co,. Ltd.
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