Metal mask and method of printing lead-free solder paste...

Metal fusion bonding – Process – Preplacing solid filler

Reexamination Certificate

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Details

C228S022000

Reexamination Certificate

active

10803884

ABSTRACT:
A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask1on a circuit board2having an electrode21formed in a predetermined pattern to join an end portion of a lead member6, and moving a printing squeegee along the upper surface of the metal mask1to thereby print a lead-free solder paste on the surface of the electrode21on the circuit board2. The method produces on the electrode21of the circuit board2two lead-free solder paste patterns30a, 30aeach circular or elliptical in shape and arranged in a direction in which the lead member6is to extend from the electrode.

REFERENCES:
patent: 5593080 (1997-01-01), Teshima et al.
patent: 5740730 (1998-04-01), Thompson, Sr.
patent: 5868070 (1999-02-01), Barlow
patent: 10055101 (2002-05-01), None
patent: 63-115169 (1988-05-01), None
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patent: 4-57390 (1992-02-01), None
patent: 8-230346 (1996-10-01), None
patent: 2001-39048 (2001-02-01), None
patent: WO 02/40213 (2002-05-01), None
patent: 2002-362003 (2002-12-01), None
patent: 2003-8193 (2003-01-01), None
patent: 2003-10996 (2003-01-01), None
Shiro, Translation to JP 8-230346; Oct. 9, 1996; pp. 1-3.
European Patent Office Communication for corresponding European Patent Application No. 04006594 dated Jul. 23, 2004.

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