Metal layout pattern for improved passivation layer coverage

Details Metal layout pattern for improved passivation layer coverage Metal layout pattern for improved passivation layer coverage

1996-02-27

1997-09-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257774, 257775, H01L 2348

Patent

active

056635990

ABSTRACT:
An integrated circuit incorporates a metal wiring line layout scheme which reduces the likelihood of incorporating holes through the passivation layer which covers the metal wiring line. Wiring lines are formed so as to have constant separation around bends in the wiring lines, typically by also increasing the width of the wiring lines around the bends. This layout reduces the likelihood of forming holes in the passivation layer between wiring lines. Holes are prevented near the ends of wiring lines either by providing dummy wiring lines offset from the ends of the wiring lines or by reducing the height of the wiring lines at the ends of the wiring lines. The ends of wiring lines can be sloped by providing dummy vias at the ends of the wiring lines and forming the ends of the wiring lines in the dummy vias.

REFERENCES:
patent: 5004704 (1991-04-01), Maeda et al.
patent: 5032890 (1991-07-01), Ushiku et al.
patent: 5124275 (1992-06-01), Selle et al.
patent: 5166101 (1992-11-01), Lee et al.
patent: 5182235 (1993-01-01), Eguchi
patent: 5192715 (1993-03-01), Sliwa, Jr. et al.
patent: 5278103 (1994-01-01), Mallon et al.
patent: 5281555 (1994-01-01), Cho
patent: 5310700 (1994-05-01), Lien et al.
patent: 5357140 (1994-10-01), Kozasa
patent: 5407860 (1995-04-01), Stoltz et al.
patent: 5441915 (1995-08-01), Lee
patent: 5476817 (1995-12-01), Numata
patent: 5516720 (1996-05-01), Lur et al.
Stanley Wolf, Ph.D., "Silicon Processing for the VLSI Era," vol. 2: Process Integration, pp. 200-204.

Affiliated with

Also associated with

Rating

Metal layout pattern for improved passivation layer coverage does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal layout pattern for improved passivation layer coverage, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal layout pattern for improved passivation layer coverage will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-311659