Metal jet deposition system

Details Metal jet deposition system Metal jet deposition system

1998-08-19

2000-06-20

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

22818021, B23K 100, B23K 500, B23K 2008, B23K 3100, B23K 3102

Patent

active

060767235

ABSTRACT:
A metal jet, metal deposition system has metal jets disposed in an oxygen-free chamber. The metal jets eject droplets of a wetting metal onto conductors on an electrical substrate followed by solder metal. Banks of metal jets can be used to print conductors onto the electrical substrate.

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