Metal ion-containing CMP composition and method for using...

Abrasive tool making process – material – or composition – With inorganic material – Metal or metal oxide

Reexamination Certificate

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C051S307000

Reexamination Certificate

active

08038752

ABSTRACT:
The invention provides a chemical-mechanical polishing composition comprising an abrasive, metal ions (M) having a M-O—Si bond energy equal to or greater than about 3 kcal/mol, and water. The invention further provides a method for polishing a substrate using the aforementioned chemical-mechanical polishing composition.

REFERENCES:
patent: 4671851 (1987-06-01), Beyer et al.
patent: 4789648 (1988-12-01), Chow et al.
patent: 4910155 (1990-03-01), Cote et al.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5137544 (1992-08-01), Medellin
patent: 5157876 (1992-10-01), Medellin
patent: 5209816 (1993-05-01), Yu et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5354490 (1994-10-01), Yu et al.
patent: 5366542 (1994-11-01), Yamada et al.
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5476606 (1995-12-01), Brancaleoni et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5741626 (1998-04-01), Jain et al.
patent: 5770095 (1998-06-01), Sasaki et al.
patent: 5958288 (1999-09-01), Mueller et al.
patent: 6251150 (2001-06-01), Small et al.
patent: 6379406 (2002-04-01), Thomas et al.
patent: 6589100 (2003-07-01), Moeggenborg et al.
patent: 6641631 (2003-11-01), Thomas et al.
patent: 6730245 (2004-05-01), Hampden-Smith et al.
patent: 7153335 (2006-12-01), Siddiqui et al.
patent: 2002/0010232 (2002-01-01), Ogawa et al.
patent: 2002/0039839 (2002-04-01), Thomas et al.
patent: 2003/0104770 (2003-06-01), Pasqualoni et al.
patent: 2003/0124959 (2003-07-01), Schroeder et al.
patent: 2003/0196386 (2003-10-01), Hattori et al.
patent: 2005/0279733 (2005-12-01), Carter et al.
patent: 0 845 512 (1998-06-01), None
patent: 1 211 024 (2002-06-01), None
patent: WO 99/53532 (1999-10-01), None
patent: WO 02/055259 (2002-07-01), None
patent: WO 02/055259 (2002-09-01), None
patent: WO 03/068882 (2003-08-01), None
patent: WO 2006/009640 (2006-01-01), None
Dugger et al.,The Journal of Physical Chemistry, 68(4), 757-760 (1964).

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