Metal-insulator resistive ribbon for thermal transfer printing

Details Metal-insulator resistive ribbon for thermal transfer printing Metal-insulator resistive ribbon for thermal transfer printing

1982-12-30

1985-01-01

Wright, Jr., Ernest T.

Typewriting machines

Including interposed inking device for record-medium

Ribbon, per se

400120, 428913, 428914, B41J 3102

Patent

active

044914318

ABSTRACT:
A resistive ribbon printing technique is described in which the ribbon includes a resistive layer comprised of a metal-wide bandgap insulator combination. The ribbon also includes a support layer, where the support function can be provided by the resistive layer, and a fusible ink layer. Electrical current through the resistive layer produces heat which locally melts the ink for transfer to an adjacent receiving medium. The wide bandgap insulator of the resistive layer must have a bandgap of at least three volts. Many different metals and insulators can be used, where the relative amounts of metal and insulator are chosen to provide a desired resistivity for any type of resistive ribbon printing application.

REFERENCES:
patent: 3744611 (1973-07-01), Montanari et al.
patent: 4268368 (1981-05-01), Aviram et al.
patent: 4309117 (1982-01-01), Chang et al.
IBM Technical Disclosure Bulletin, "Electrothermic Printing Method and Apparatus Using a Photoconductor and Fusible Ink," Aviram, vol. 20, No. 2, Jul. 1977, pp. 808-809.
IBM Technical Disclosure Bulletin, "Thermal Building Technique for Electrothermic Printing," Wilbur, vol. 23, No. 9, Feb. 1981, p. 4302.
IBM Technical Disclosure Bulletin, "Electrothermal Print Head," Wilbur, vol. 23, No. 9, Feb. 1981, pp. 4305-4306.
IBM Technical Disclosure Bulletin, "Inorganic Resistive Layer for Electrothermal Printing," Chang, vol. 24, No. 11B, Apr. 1982, p. 6195.
IBM Technical Disclosure Bulletin, "Amorphous Film Printing Using DC Power and Pulse Selection," Aviram et al., vol. 25, No. 5, Oct. 1982, pp. 2602-2603.

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