Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2007-01-09
2007-01-09
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C257S432000
Reexamination Certificate
active
10975940
ABSTRACT:
A method for forming a metal-insulator-metal device includes imprinting at least one first layer to form a first impression, removing a portion of at least one second layer through the first depression to form a recess in the at least one second layer bordered by a first side, a first overhang along the first side, a second opposite side and a second overhang along the second side. The method also includes depositing a first metal in the recess spaced from the first side and the second side and oxidizing the first metal to create a non-linear dielectric.
REFERENCES:
patent: 5142390 (1992-08-01), Ohta et al.
patent: 5164850 (1992-11-01), Tanaka et al.
patent: 5289300 (1994-02-01), Yamazaki et al.
patent: 5831695 (1998-11-01), Matsumoto
patent: 5994748 (1999-11-01), Inoue et al.
patent: 6008872 (1999-12-01), den Boer et al.
patent: 6124606 (2000-09-01), den Boer et al.
patent: 6225968 (2001-05-01), den Boer et al.
patent: 6243062 (2001-06-01), den Boer et al.
patent: 6285419 (2001-09-01), Inoue et al.
patent: 6350557 (2002-02-01), Aomori et al.
patent: 6384880 (2002-05-01), Inoue et al.
patent: 6424399 (2002-07-01), Shimada et al.
patent: 6480182 (2002-11-01), Turner et al.
patent: 6563555 (2003-05-01), Inoue et al.
patent: 6710826 (2004-03-01), Inoue et al.
patent: 2001/0045934 (2001-11-01), Turner et al.
patent: 2002/0093601 (2002-07-01), Inoue et al.
patent: 2003/0142062 (2003-07-01), Turner et al.
patent: 2004/0014265 (2004-01-01), Kazlas et al.
patent: 2005/0202580 (2005-09-01), Weng
patent: 62-264686 (1987-11-01), None
patent: WO 2004/059378 (2004-07-01), None
I. Schwendeman, J. Hwang, D.M. Welsh, D.B. Tanner, J.R. Reynolds,Combined Visible and Infrared Electrochromism Using Dual Polymer Devices, Advanced Materials 2001, 13, No. 9, May 3, p. 634 (4 pgs.).
J. Revie, T. Nelson,Thin-Film Transistor LCD Displays, printed from www.cs.ndsu.nodak.edu on Jul. 26, 2004, last updated Jun. 6, 1996 (5 pgs.).
Posted in Nov. 28, 2003The Fatty Newsroom By B. P. Sydenstricker,Plastic Promises Dense Data Store, printed from www.fbbn.com/cgi.bin/viewnews.col on Jul. 26, 2004, Source: BBC (3 pgs.).
W. den Boer, 6.2:A Select Line Driver for the Offset-Scan-and-Hold-Dual Select Diode AMLCDs, SID 01 Digest, p. 44 (4 pgs.).
W. den Boer et al.,Dual Branch MIM Array Technology for Low-Cost AMLCDs, SID 98 Digest (4 pgs.).
Mardilovich Peter
Rudin John Christopher
Ulmer Kurt
Weng Jian-gang
LandOfFree
Metal-insulator-metal device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal-insulator-metal device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal-insulator-metal device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3779704