Metal insert and rough-surface treatment method thereof

Details Metal insert and rough-surface treatment method thereof Metal insert and rough-surface treatment method thereof

1993-07-12

1996-12-17

Walsh, Donald P.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428546, 427 98, B22F 500, B05D 512

Patent

active

055851959

ABSTRACT:
A metal insert at least partially embedded in a molded resin mass comprises a metal insert blank, and a substantial amount of nickel or nickel alloy granulations produced over a surface of the metal insert blank, and the size of the granulations is at most 1.0 .mu.m. The metal insert blank is treated by a first electrolytic plating process such that a substantial quantity of copper nuclei spreaded over the surface, and the copper nuclei are grown up as the nickel or nickel alloy granulations by a second electrolytic-plating process. The first electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.0 .mu.m, and the second electrolytic-plating process is controlled such that an average thickness of plating is from about 0.5 to about 1.5 .mu.m.

REFERENCES:
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patent: 5221859 (1993-06-01), Kobayashi et al.
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Patent Abstracts of Japan, vol. 13, No. 280 (E-779) 27 Jun. 1989 & JP-A-01 065 898 (Fujitsu Ltd) 13 Mar. 1989.
Patent Abstracts of Japan, vol. 14, No. 507 (E-998) 6 Nov. 1990 & JP-A-02 209 759 (Shinko Electric Ind Co Ltd) 21 Aug. 1990.
Patent Abstracts of Japan, vol. 15, No, 98 (E-1042) 8 Mar. 1991 & JP-A-02 308 555 (Toshiba Corp) 21 Dec. 1990.

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