Metal housing for electronic devices and method of producing suc

Details Metal housing for electronic devices and method of producing suc Metal housing for electronic devices and method of producing suc

1992-01-09

1993-10-26

Picard, Leo P.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

361818, 439609, H05K 900

Patent

active

052568334

ABSTRACT:
A metal housing for electronic devices configured for electromagnetic compatibility includes a housing body whose opening can be closed by a closing element. Metal contact faces are provided around the opening at the housing body and correspondingly at the closing element. Thin contact strips of electrically conductive and corrosion resistant metal are applied to the contact faces. These contact strips may be subsequently melted or welded on by means of a laser beam as a weld trace or as a thin metal foil. To seal the groove between the housing body and the closing element against interfering electromagnetic radiation, the contact faces are brought into a good electrically conductive connection with one another by way of the bare metal surfaces of the contact strips applied thereonto, for example by means of an intermediately disposed elastic and electrically conductive seal.

REFERENCES:
patent: 3277230 (1966-10-01), Stickney et al.
patent: 3505463 (1970-04-01), McAdams
patent: 4572921 (1986-02-01), May et al.
patent: 5045635 (1991-09-01), Kaplo et al.
patent: 5107071 (1992-04-01), Nakagawa
patent: 5202536 (1993-04-01), Buonano
Laser Praxis [Laser Practice]; Jun. 1990, p. 22 "Einfacher arbeiten in jeder Dimension" [Work Easier in every Dimension]; W. Hunziker and A. P. Schwarzenbach.
Laser Praxis [Laser Practice]; Oct. 1990, p. 101 "Reparaturbeschichten von Turbinenschaufeln" [Repair Coating of Turbine Vanes]; K. G. Thiemann, H. Ebsen et al.

Affiliated with

Also associated with

Rating

Metal housing for electronic devices and method of producing suc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal housing for electronic devices and method of producing suc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal housing for electronic devices and method of producing suc will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-960662