Metal foil with improved bonding to substrates and method for ma

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...

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205102, 205181, 205191, C25D 706, C25D 518, C25D 512, C23C 2800

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active

059085428

ABSTRACT:
In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.

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patent: 5262247 (1993-11-01), Kajiwara et al.
patent: 5314756 (1994-05-01), Tagaya
patent: 5332488 (1994-07-01), Mitsuji

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