Metal foil-clad laminate

Details Metal foil-clad laminate Metal foil-clad laminate

2007-05-15

2007-05-15

Tran, Thao (Department: 1711)

Stock material or miscellaneous articles

Composite

Of metal

C428S473500, C428S901000

Reexamination Certificate

active

10841432

ABSTRACT:
The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I:wherein R and Φ are as defined in the specification, at least one insulating substrate, and at least one metal foil layer. The polyimide is excellent in thermopress-bonding property, solubility in solvents and heat resistance, and exhibits a low dielectric constant. The metal foil-clad laminate having the polyimide layer is suitably applicable to high-frequency printed wiring boards, etc.

REFERENCES:
patent: 4094862 (1978-06-01), Bell
patent: 4915983 (1990-04-01), Lake et al.
patent: 6887580 (2005-05-01), Tokuhisa et al.
patent: 2002322274 (2002-11-01), None

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