Metal electronic package with reduced seal width

Details Metal electronic package with reduced seal width Metal electronic package with reduced seal width

1992-10-13

1994-06-28

Donovan, Lincoln

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 251687, 251788, H01L 2328, H01L 2302

Patent

active

053248880

ABSTRACT:
There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

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C. P. Wong, John M. Segelken and John W. Balde, entitled "Understanding the Use of Silicone Gels for Nonhermetic Plastic Packaging" appearing in IEEE Transactions on Components, Hybrids and Manufacturing Technology, Dec. 1989, vol. 12, No. 4, at pp. 421-425.
John W. Balde, entitled "The IEEE Gel Task Force -An Early Look at the Final Testing" appearing in IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 1, 12, No. 4, Dec. 1989; at pp. 426-429.
Kent Adams, entitled "Applications for Sealants" appearing in Engineered Materials Handbook, vol. 3, Adhesives and Sealants, 1990, at pp. 604-612.

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