Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1993-09-27
1995-03-21
LeDynh, Bot
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 522, 257680, 257682, 257687, 257787, 257791, H01L 2302, H01L 2328, H05K 506
Patent
active
053998057
ABSTRACT:
There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.
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C. P. Wong, John M. Segelken, John W. Balde "Understanding the Use of Silicon Gels for Nonhermetic Plastic Packaging" appearing in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Dec. 1989, vol. 12, No. 4, (ISSN 0148-6411) at pp. 421-425.
John W. Balde "The IEEE Gel Task Force--An Early Look at the Final Testing" appearing in IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 12, No. 4, (Dec. 1989) at pp. 426-429.
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Braden Jeffrey S.
Hoffman Paul R.
Mahulikar Deepak
Pasqualoni Anthony M.
Tyler Derek E.
Ledynh Bot
Olin Corporation
Rosenblatt Gregory S.
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