Patent
1986-11-13
1989-03-14
James, Andrew J.
357 72, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
048128961
ABSTRACT:
A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.
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Gavin David F.
Hart William W. C.
Phillips Steven D.
Rothgery Eugene F.
Sandel Bonnie B.
Crane Sara W.
James Andrew J.
Olin Corporation
Rosenblatt Gregory S.
Weinstein Paul
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