Metal electronic package sealed with thermoplastic having a graf

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Details

357 72, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

048128961

ABSTRACT:
A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.

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