Metal electronic package having improved resistance to electroma

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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357 74, 357 84, 174 35R, H01L 2302

Patent

active

050435345

ABSTRACT:
A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.

REFERENCES:
patent: 3469017 (1969-09-01), Starger
patent: 3614546 (1971-10-01), Avins
patent: 3747829 (1973-07-01), Hofmeister
patent: 3801728 (1974-04-01), Gallo, Jr. et al.
patent: 3825876 (1974-07-01), Damon et al.
patent: 4035046 (1977-07-01), Kloth
patent: 4390220 (1983-06-01), Benasutti
patent: 4410927 (1983-10-01), Butt
patent: 4461924 (1984-07-01), Butt
patent: 4480262 (1984-10-01), Butt
patent: 4498121 (1985-02-01), Breedis et al.
patent: 4521469 (1985-06-01), Butt et al.
patent: 4525422 (1988-06-01), Butt et al.
patent: 4582556 (1986-04-01), Butt et al.
patent: 4649461 (1987-03-01), Matsuta
patent: 4658334 (1987-04-01), McSparran et al.
patent: 4685034 (1987-08-01), Tetsu et al.
patent: 4796083 (1989-01-01), Cherukuri et al.
patent: 4800464 (1989-01-01), Roos et al.
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 4827376 (1989-05-01), Voss
patent: 4831211 (1989-05-01), McPherson et al.
patent: 4831498 (1989-05-01), Baba
patent: 4849857 (1989-07-01), Butt et al.
patent: 4866571 (1989-09-01), Butt
patent: 4888449 (1989-12-01), Crane et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
Matisoff, "Handbook of Electronics Packaging Design and Engineering", at Chapter 11, entitled, `Radio Frequency and Electromagnetic Shielding` (pp. 233-257), Van Nostrand Reinhold Company, 1982.
Shrivastava, entitled, "Inductance Calculation and Optimal Pin Assignment for the Design of Pin-Grid Array and Chip Carrier Packages", appearing in IEEE Transactions on Components, Hybrids & Manufacturing Technology, vol. 13, No. 1, Mar. 1990, pp. 147-153.

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