Metal electronic package

Details Metal electronic package Metal electronic package

1988-02-10

1990-01-30

Picard, Leo

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 174 17GF, H01L 2320

Patent

active

048975087

ABSTRACT:
A metal package for housing an electronic device wherein the electronic device is attached to a severable die attach pad. The die attach pad is bonded to the base of the package with a thermally conductive medium. The base is bonded to the die attach pad and to the leadframe at the same time to reduce the thermal degradation of the sealants. In other embodiments, apertures are provided in the base component to enhance cooling of the electronic device and in the cover component to vent reaction by-products.

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Electrical Manufacturing, May 1957, p. 142.
"Future Packages Heat Transfer Will Affect PCB Designs" by Ernel R. Winkler appeared in 4/85 Edition of Packaging & Production, pp. 104-109.

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