Coating processes – With post-treatment of coating or coating material – Heating or drying
Reexamination Certificate
2006-08-28
2009-11-10
Zimmerman, John J (Department: 1794)
Coating processes
With post-treatment of coating or coating material
Heating or drying
C427S376800, C205S226000, C428S648000, C428S675000, C428S929000, C428S939000, C257S677000, C148S537000
Reexamination Certificate
active
07615255
ABSTRACT:
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
REFERENCES:
patent: 4049471 (1977-09-01), Koontz
patent: 4053373 (1977-10-01), McMullen et al.
patent: 4102755 (1978-07-01), Brugger et al.
patent: 4186064 (1980-01-01), Morrissey
patent: 4199416 (1980-04-01), Middleton et al.
patent: 4230493 (1980-10-01), Felten
patent: 4626479 (1986-12-01), Hosoi et al.
patent: 4880507 (1989-11-01), Toben et al.
patent: 4888574 (1989-12-01), Rice et al.
patent: 4994155 (1991-02-01), Toben et al.
patent: 5164069 (1992-11-01), Cerwonka
patent: 5174887 (1992-12-01), Federman et al.
patent: 5182172 (1993-01-01), Tucker
patent: 5235139 (1993-08-01), Bengston et al.
patent: 5397599 (1995-03-01), Chao et al.
patent: 5492615 (1996-02-01), Houman
patent: 5667849 (1997-09-01), Carey, II et al.
patent: 5675177 (1997-10-01), Abys et al.
patent: 5871631 (1999-02-01), Ichiba et al.
patent: 5916696 (1999-06-01), Abys et al.
patent: 6036833 (2000-03-01), Tang et al.
patent: 6210556 (2001-04-01), Toben et al.
patent: 6259161 (2001-07-01), Wu et al.
patent: 6287896 (2001-09-01), Yeh et al.
patent: 6452258 (2002-09-01), Abys et al.
patent: 6613451 (2003-09-01), Asahara et al.
patent: 6736886 (2004-05-01), Suda et al.
patent: 6773568 (2004-08-01), Egli et al.
patent: 6797142 (2004-09-01), Crosby
patent: 6858122 (2005-02-01), Kondo et al.
patent: 7238432 (2007-07-01), Haketa
patent: 2002/0185716 (2002-12-01), Abys et al.
patent: 2002/0192492 (2002-12-01), Abys et al.
patent: 2003/0025182 (2003-02-01), Abys et al.
patent: 2003/0042047 (2003-03-01), Shimizu
patent: 2003/0151141 (2003-08-01), Matsuki et al.
patent: 2003/0218058 (2003-11-01), Shaw et al.
patent: 2004/0099340 (2004-05-01), Zhang et al.
patent: 2004/0211817 (2004-10-01), Jin et al.
patent: 2005/0048309 (2005-03-01), Haketa
patent: 2005/0249969 (2005-11-01), Xu et al.
patent: 2007/0052105 (2007-03-01), Lau et al.
patent: 0 160 761 (1989-02-01), None
patent: 07-041985 (1995-02-01), None
patent: 1995041985 (1995-02-01), None
patent: 2001-274539 (2001-10-01), None
patent: 2005-109373 (2005-04-01), None
patent: 2004/050959 (2004-06-01), None
Kwok Raymund W. M.
Lau Danny
Piskorski John J.
Rohm and Haas Electronic Materials LLC
Zimmerman John J
LandOfFree
Metal duplex method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Metal duplex method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal duplex method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4107384