Metal deposition process

Details Metal deposition process Metal deposition process

1974-10-01

1978-01-03

Gwinnell, Harry J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427129, 427304, 427305, 427306, 204 30, B05D 512

Patent

active

040668045

ABSTRACT:
Metal is deposited on a substrate containing neutral radicals, radical cations or neutral molecules (the latter being derived from a dication normally stable in aqueous media), by contacting the substrate with an electroless plating solution, optionally after sensitization with a salt of a platinum group metal silver or gold. The use of the process for data recording, particularly for the production of magnetic information carriers e.g. tapes or discs, metallizing plastic foam and for producing printed circuits is described.

REFERENCES:
patent: 2979422 (1961-04-01), Bersin
patent: 3033703 (1962-05-01), Schneble et al.
patent: 3035944 (1962-05-01), Sher et al.
patent: 3083118 (1963-03-01), Bridgeford
patent: 3111424 (1963-11-01), LeClair
patent: 3222210 (1965-12-01), Hammond
patent: 3222218 (1965-12-01), Beltzer et al.
patent: 3326719 (1967-06-01), Beltzer et al.
patent: 3429706 (1969-02-01), Shepard et al.
patent: 3436468 (1969-04-01), Haberecht
patent: 3579428 (1971-05-01), Kuroda et al.

Affiliated with

Also associated with

Rating

Metal deposition process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal deposition process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal deposition process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-281817