Metal core printed circuit boards

Details Metal core printed circuit boards Metal core printed circuit boards

1986-01-15

1987-12-08

Swisher, Nancy A.

Stock material or miscellaneous articles

Composite

Of metal

428209, 4284735, 428901, 430942, 427 97, 427 98, 427435, B32B 1508, B32B 2700, B05D 512, B05D 118

Patent

active

047118229

ABSTRACT:
Disclosed is a method of making a printed circuit board by exposing in a circuit pattern the polymeric surface of a conductive substrate coated with a polymer selected from the group consisting of polyimides, polyamide-imides, polyester-amide-imides, polysulfones, polyphenylene sulfides, and polyphenylene oxides, to an ion beam at an energy of about 50 KeV to about 2 MeV and a fluence of about 10.sup.15 to 10.sup.18 ions/cm.sup.2. The surface is then wet blasted and the portions of the polymeric surface that have been exposed to the ion beam are electrolessly plated with a metal such as nickel or copper. Also disclosed is a coated substrate comprising a metal or conductive surface and an imide polymeric coating on the surface which can be electrophoretically deposited, a portion of which has been exposed to an ion beam.

REFERENCES:
patent: 4188415 (1980-02-01), Takahashi et al.
patent: 4254172 (1981-03-01), Takahashi et al.
patent: 4293624 (1981-10-01), Buckley
patent: 4347304 (1982-08-01), Sakurai et al.
patent: 4599137 (1986-07-01), Akiya
patent: 4601916 (1986-07-01), Arachtingi

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