Metal contact LGA socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S066000, C439S068000

Reexamination Certificate

active

07059869

ABSTRACT:
A socket which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. Pins are securely located on the substrate, which are used to align the interconnect with the electrical component for connection.

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patent: 6786738 (2004-09-01), Lin
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patent: 6966783 (2005-11-01), Hachuda et al.
patent: 2005/0037639 (2005-02-01), Bali et al.

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