Chemistry: electrical and wave energy – Processes and products
Patent
1978-10-18
1980-11-18
Mack, John H.
Chemistry: electrical and wave energy
Processes and products
204 33, 204 40, C25D 104, C25D 544
Patent
active
042343950
ABSTRACT:
A metal composite comprising a substrate having a uniformly, mildly etched surface of an aluminum alloy, e.g. an alloy, consisting of at least about 99 wt. % aluminum, and the balance comprising specified quantities of silicon, iron, copper, manganese and zinc, and a uniformly adhering, electrocathodically deposited copper foil. The resulting peel strength between the aluminum alloy surface and the copper foil, after lamination of the composite to a resinous substrate under heat and pressure is within the range of from about 6 to about 8 lbs./in. of width of copper foil. This can be reduced to a value within the range of about 0.3 to about 2 lbs./in. of width by overplating the copper foil with a layer of zinc or indium. The resinous substrate may be a glass fiber reinforced epoxy resin, such as is used in the manufacture of printed circuit boards.
REFERENCES:
patent: 2871171 (1959-01-01), Atkinson
patent: 3775265 (1973-11-01), Bharucha et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3998601 (1976-12-01), Yates et al.
Metal Finishing Guidebook and Directory, 1975, Metals and Plastics Publications, Inc., Hackensack, N.J., p. 144.
Alloy Digest, Aluminum 1100 Filing Code:Al-44, Oct. 1956, Published by Engineering Alloys Digest, Inc., Upper Montclair, New Jersey.
Berdan Betty L.
King William M.
Baumann Russell E.
Gould Inc.
Leader William
Mack John H.
Sachs Edward E.
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